Precise copper plating on complex components thanks to ATOTECH technology.
Miedziowanie chemiczne to proces chemicznego osadzania miedzi na powierzchniach poprzez redukcję, umożliwiający powlekanie nawet bardzo skomplikowanych detali. Zastosowanie technologii firmy ATOTECH zapewnia wysoką jakość i trwałość powłoki. Główne zastosowania tego procesu znajdują się w branży elektronicznej, szczególnie przy produkcji półprzewodników oraz obwodów drukowanych (PCB).
The chemical copper plating process is an advanced method of applying a thin layer of copper to the surface of components through a non-electrical chemical reduction reaction. Unlike traditional electroplating, this process does not require an external power source, which allows for effective coating of even extremely complex and hard-to-reach shapes and details of various sizes.
The components are immersed in a specially prepared chemical bath, where a carefully selected composition of copper compounds and reducing agents initiates the slow deposition of copper on the surface in a controlled and uniform manner. The thickness of the coating, usually in the range of 3 to 5 microns, guarantees optimal electrical conductivity and excellent adhesion to the substrate, which is particularly important in electronic applications such as coating printed circuits and semiconductors.
Thanks to the use of ATOTECH technology, the process is stable, repeatable and compliant with strict RoHS and WEEE environmental standards, making it an environmentally friendly and safe solution for users and the environment. The high quality of the chemical copper coating not only gives the components protective properties, but also improves their functionality, enabling further technological processes such as soldering or electronic assembly. The barrel method allows for the serial and efficient processing of very small parts, making this process extremely efficient in the electronics manufacturing industry.
The process is carried out using a barrel method, which enables effective and precise tin plating of very small components in production series. This approach ensures high efficiency and consistent coating quality, while allowing for flexible adaptation to customer requirements and the specific characteristics of the components.
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